Technical Advantage Description: 

This system is a professional design software tailored for high-density interconnect (HDI) flexible circuit boards. The system integrates functions such as parametric modeling, micro-blind via optimization, and stress simulation. It supports bend radius calculation for flexible substrates (such as polyimide), dynamic routing strategies, and 3D design of rigid-flex PCB. The system enables precise control of parameters such as line width/spacing and interlayer dielectric thickness, significantly improving the design efficiency and reliability of HDI flexible boards.