Technical Advantage Description:

This is a software platform specifically designed for high-density circuit board etching, integrating geometric pattern editing, process parameter optimization, and 3D simulation. With high-precision compensation algorithms and multi-task parallel processing technology, it enables precise control of etching depth, line width, and undercut, achieving micron-level line etching. It supports mainstream CAD file import and standardized data output, and is widely used in fields such as semiconductors and 5G communications.